Testing

External Visual Inspection

During this process, the component is inspected for its brand, data code, origin, surface quality, condition of the pins, defects, labelling, originality of the producer label and positioning of the logo as per the data sheet.

Decapsulation

Decapsulation includes the opening of the plastic packaging to reveal the die located inside.
This process allows us to physically see the type of die belonging to the component under inspection. Decapsulation also allows us to check the topography of the die by checking the producer brand, while we can also check the date of copyright, part number, dimension of the die in case of different data codes. It also reveals the internal wiring plan and the direct positioning of the die in relation to the pins.

Heated Chemical Test

HCT is a process that uses a specific chemical product which – when heated to a certain temperature – causes the surface of the packaging to dissolve, revealing any marks, cracks, non-original branding and repair work to the pins.

Solderability testing

Solderability testing is carried out according to the J-STD-002B standard. This test determines the solderability capacity of the component’s pins.

Electrical and temperature testing

This test is carried out on a wide range of components, ranging from base-level tests to checks on Mil STD 883 devices.

Radiography X-Ray

This is a non-invasive test used to examine the internal hardware of the component.
The test checks the lead frame of the component, the dimension of the die, the quality of the tracks and any damage, as well as ensuring the die is present inside the component under examination. The test is carried out on an original device made by the producer and of reliable provenance. The test will reveal if the producer has altered the internal lead frame, dimension of the die and internal tracks without warning, as per the data sheet.

Baking and Dry Packing

This service includes J-STD-033B.1 baking and dry packing.
Baking and dry packing is carried out to avoid damage caused by damp being absorbed by the component, protecting it from breakage and degradation during the flux soldering process, which is carried out at high temperatures.

BGA-Reballing

The Ball Grid Array (BGA) Reballing service allows us to process the components to make them solderable and usable again by removing and reinstalling the balls. The process also allows us to make lead components RoHS compliant by replacing lead balls.

Part search

News

CHIPANALOG

Nel 2022 il mercato mondiale dei semiconduttori è cresciuto oltre 1%.Questo grazie anche alla crescita continua del mercato industriale ed automotive. CHIP ANALOG Produttore entrato da oltre 4 anni sul mercato europeo e americano.PAROLA CHIAVE REPERIBILITÀ Un listino che vanta un lead time dalle 4 alle 10 settimaneCatalogo con più di 400 codici con le

27 February 2023 Read more
SMARTSEMI

Delta Elettronica è orgogliosa di comunicare che, al ﬁne di dare un sempre maggioreservizio verso i propri clienti, distribuisce ora anche Smart Semi. SMARTsemi fornisce soluzioni di memoria long life per applicazioni embedded , adatteparticolarmente in campo medicale, robotica industriale, comunicazione, networking,home automazione, gaming e attrezzature per la difesa. L’attuale catalogo dei prodotti include dispositivi DDR3

23 January 2023 Read more
NUOVE CASE DISTRIBUITE

Delta Elettronica srlViale del Ghisallo,16 – 20151 MilanoTel. +39 024856111e-mail sales@delta-elettronica.itP.IVA/CF 12303480151 Da più di 40 anni sul mercato Delta Elettronica conosciuta e apprezzata soprattutto per il servizio di reperimento di componenti elettronici hard to find e obsoleti, in un momento particolare di mercato come quello attuale, caratterizzato da lunghi lead time e carenza di materiale ha scelto di incrementare

27 September 2022 Read more