External Visual Inspection
During this process, the component is inspected for its brand, data code, origin, surface quality, condition of the pins, defects, labelling, originality of the producer label and positioning of the logo as per the data sheet.
Decapsulation includes the opening of the plastic packaging to reveal the die located inside.
This process allows us to physically see the type of die belonging to the component under inspection. Decapsulation also allows us to check the topography of the die by checking the producer brand, while we can also check the date of copyright, part number, dimension of the die in case of different data codes. It also reveals the internal wiring plan and the direct positioning of the die in relation to the pins.
Heated Chemical Test
HCT is a process that uses a specific chemical product which – when heated to a certain temperature – causes the surface of the packaging to dissolve, revealing any marks, cracks, non-original branding and repair work to the pins.
Solderability testing is carried out according to the J-STD-002B standard. This test determines the solderability capacity of the component’s pins.
Electrical and Temperature Testing
This test is carried out on a wide range of components, ranging from base-level tests to checks on Mil STD 883 devices.
This is a non-invasive test used to examine the internal hardware of the component.
The test checks the lead frame of the component, the dimension of the die, the quality of the tracks and any damage, as well as ensuring the die is present inside the component under examination. The test is carried out on an original device made by the producer and of reliable provenance. The test will reveal if the producer has altered the internal lead frame, dimension of the die and internal tracks without warning, as per the data sheet.
Baking and Dry Packing
This service includes J-STD-033B.1 baking and dry packing.
Baking and dry packing is carried out to avoid damage caused by damp being absorbed by the component, protecting it from breakage and degradation during the flux soldering process, which is carried out at high temperatures.
The Ball Grid Array (BGA) Reballing service allows us to process the components to make them solderable and usable again by removing and reinstalling the balls.
The process also allows us to make lead components RoHS compliant by replacing lead balls.